About

Dr. Jun He is TSMC's Vice President of Operations/Advanced Packaging Technology and Service, promoted to Vice President in November 2020. Before joining TSMC in May 2017 he was a Senior Director of Quality and Reliability in Intel's Technology and Manufacturing Group; he holds a Ph.D. in materials science and engineering from the University of California, Santa Barbara.

Roles

Taiwan Semiconductor Manufacturing Co., Ltd.
Vice President, Operations/Advanced Packaging Technology and Service · Current role
2017–present
Intel Corporation
Senior Director, Quality and Reliability
—

Also at Taiwan Semiconductor Manufacturing Co., Ltd.

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