About

K.C. Hsu is TSMC's Vice President of Research & Development/Integrated Interconnect & Packaging, promoted to Vice President in November 2021. Before joining TSMC that month he was Chairman, Taiwan at Micron Technology, Inc.; he holds an M.S. degree in Management of Technology from National Chiao Tung University.

Roles

Taiwan Semiconductor Manufacturing Co., Ltd.
Vice President, Research & Development/Integrated Interconnect & Packaging · Current role
2021–present
Micron Technology, Inc.
Chairman, Taiwan
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Also at Taiwan Semiconductor Manufacturing Co., Ltd.

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